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d a t a sh eet product speci?cation supersedes data of april 1993 file under integrated circuits, ic02 june 1994 integrated circuits philips semiconductors tdf8704 8-bit high-speed analog-to-digital converter
june 1994 2 philips semiconductors product speci?cation 8-bit high-speed analog-to-digital converter tdf8704 features 8-bit resolution sampling rate up to 50 mhz extended temperature range ( - 40 to +85 c) high signal-to-noise ratio over a large analog input frequency range (7.4 effective bits at 4.43 mhz full-scale input and at f clk = 50 mhz) binary 3-state ttl outputs overflow/underflow 3-state ttl output ttl compatible digital inputs low-level ac clock input signal allowed stable internal reference voltage regulator included power dissipation only 380 mw (typical) low analog input capacitance, no buffer amplifier required no sample-and-hold circuit required. applications general purpose high-speed analog-to-digital conversion for extended temperature applications automotive rf, satellite and gps (global positioning system) medical general industrial digital video (vcr, tv and satellite). general description the tdf8704t is an 8-bit high-speed analog-to-digital converter (adc) for general industrial applications. it converts the analog input signal into 8-bit binary-coded digital words at a maximum sampling rate of 50 mhz. all digital inputs and outputs are ttl compatible, although a low-level ac clock input signal is allowed. quick reference data note 1. full-scale sine wave (f i = 4.43 mhz; f clk = 50 mhz). ordering information symbol parameter conditions min. typ. max. unit v cca analog supply voltage 4.75 5.0 5.25 v v ccd digital supply voltage 4.75 5.0 5.25 v v cco output stages supply voltage 4.75 5.0 5.25 v i cca analog supply current - 37 46 ma i ccd digital supply current - 23 35 ma i cco output stages supply current - 16 21 ma ile dc integral linear error - 0.4 1 lsb dle dc differential linearity error - 0.2 0.5 lsb aile ac integral linearity error note 1 -- 2 lsb f clk(max) maximum clock frequency 50 -- mhz p tot total power dissipation - 380 535 mw type number package sampling frequency pins pin position material code tdf8704t/2 24 so24l plastic sot137-1 20 mhz tdf8704t/4 24 so24l plastic sot137-1 40 mhz tdf8704t/5 24 so24l plastic sot137-1 50 mhz
june 1994 3 philips semiconductors product speci?cation 8-bit high-speed analog-to-digital converter tdf8704 block diagram fig.1 block diagram. handbook, full pagewidth 4 8 9 v rb v i v rt 7 v cca 23 15 13 24 d2 d3 d4 d5 d6 1 2 12 d1 d0 d7 ttl outputs clock driver 16 clk tdf8704 analog voltage input overflow / underflow output data outputs lsb msb 14 analog - to - digital converter latches msa685 17 dgnd 6 agnd analog ground digital ground 18 v ccd 11 22 ce stabilizer ttl output overflow / underflow latch 5 dec 19 v cco1 21 v cco2 20 output ground ognd
june 1994 4 philips semiconductors product speci?cation 8-bit high-speed analog-to-digital converter tdf8704 pinning symbol pin description d1 1 data output; bit 1 d0 2 data output; bit 0 (lsb) n.c. 3 not connected v rb 4 reference voltage bottom (decoupling) dec 5 decoupling input (internal stabilization loop decoupling) agnd 6 analog ground v cca 7 analog supply voltage (+5 v) v i 8 analog input voltage v rt 9 reference voltage top (decoupling) n.c. 10 not connected o/uf 11 over?ow/under?ow data output d7 12 data output; bit 7 (msb) d6 13 data output; bit 6 d5 14 data output; bit 5 d4 15 data output; bit 4 clk 16 clock input dgnd 17 digital ground v ccd 18 digital supply voltage (+5 v) v cco1 19 supply voltage for output stages 1 (+5 v) ognd 20 output ground v cco2 21 supply voltage for output stages 2 (+5 v) ce 22 chip enable input (ttl level input, active low) d3 23 data output; bit 3 d2 24 data output; bit 2 fig.2 pin configuration. handbook, halfpage 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 tdf8704 msa686 d1 d0 n.c. v rb dec agnd v cca v rt n.c. o/uf d7 d6 d5 d4 clk v ccd v cco1 ognd d3 d2 ce dgnd v cco2 v i
june 1994 5 philips semiconductors product speci?cation 8-bit high-speed analog-to-digital converter tdf8704 limiting values in accordance with the absolute maximum rating system (iec134). handling inputs and outputs are protected against electrostatic discharges in normal handling. however, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. thermal characteristics symbol parameter conditions min. max. unit v cca analog supply voltage - 0.3 +7.0 v v ccd digital supply voltage - 0.3 +7.0 v v cco output stages supply voltage - 0.3 +7.0 v d v cc supply voltage differences between v cca and v ccd - 1.0 +1.0 v d v cc supply voltage differences between v cco and v ccd - 1.0 +1.0 v d v cc supply voltage differences between v cca and v cco - 1.0 +1.0 v v i input voltage referenced to agnd - 0.3 +7.0 v v clk(p-p) ac input voltage for switching (peak-to-peak value) referenced to dgnd - v ccd v i o output current - 10 ma t stg storage temperature - 55 +150 c t amb operating ambient temperature - 40 +85 c t j junction temperature - +150 c symbol parameter value unit r th j-a thermal resistance from junction to ambient in free air 75 k/w
june 1994 6 philips semiconductors product speci?cation 8-bit high-speed analog-to-digital converter tdf8704 characteristics (see tables 1 and 2) v cca = v 7 to v 6 = 4.75 to 5.25 v; v ccd = v 18 to v 17 = 4.75 to 5.25 v; v cco = v 19 and v 21 to v 20 = 4.75 to 5.25 v; agnd and dgnd shorted together; v cca to v ccd = - 0.25 to +0.25 v; v cco to v ccd = - 0.25 to +0.25 v; v cca to v ccd = - 0.25 to +0.25 v; t amb = - 40 to +85 c; typical readings taken at v cca =v ccd = 5 v and t amb =25 c; unless otherwise speci?ed. symbol parameter conditions min. typ. max. unit supply v cca analog supply voltage 4.75 5.0 5.25 v v ccd digital supply voltage 4.75 5.0 5.25 v v cco output stages supply voltage 4.75 5.0 5.25 v i cca analog supply current - 37 46 ma i ccd digital supply current - 23 35 ma i cco output stages supply current all outputs low - 16 21 ma inputs c lock input clk ( referenced to dgnd) v il low level input voltage 0 - 0.8 v v ih high level input voltage 2.0 - v ccd v i il low level input current v clk = 0.4 v - 400 --m a i ih high level input current v clk = 2.7 v -- 100 m a v clk =v ccd -- 300 m a z i input impedance f clk = 50 mhz - 2 - k w c i input capacitance f clk = 50 mhz - 4.5 - pf v i ( analog input voltage referenced to agdn; see figs 3 and 4 and table 1) v i(b) input voltage (bottom) 1.21 1.25 1.29 v v i(0) input voltage output code = 0 1.42 1.48 1.51 v v os(b) offset voltage (bottom) v i(0) to v i(b) 210 225 240 v v i(t) input voltage (top) 3.37 3.46 3.58 v v i(255) input voltage output code = 255 3.14 3.22 3.30 v v os(t) offset voltage (top) v i(t) to v i(255) 225 240 255 v v i(p-p) input voltage amplitude (peak-to-peak value) 1.69 1.74 1.79 v i l load current on v rt and v rb - 300 - +300 m a i il low level input current v i = 1.25 v - 0 -m a i ih high level input current v i = 3.46 v 40 150 400 m a z i input impedance f i = 4.43 mhz - 10 - k w c i input capacitance f i = 4.43 mhz - 14 - pf
june 1994 7 philips semiconductors product speci?cation 8-bit high-speed analog-to-digital converter tdf8704 i nput ce ( referenced to dgnd) see table 2 v il low level input voltage 0 - 0.8 v v ih high level input voltage 2.0 - v ccd v i il low level input current v il = 0.4 v - 400 --m a i ih high level input current v ih = 2.7 v -- 20 m a reference resistance r ref reference resistance v rt to v rb - 200 -w outputs d igital outputs d7 to d0 ( referenced to dgnd) v ol low level output voltage i o = 1 ma; t amb = 0 to +85 c 0 - 0.4 v i o = 1 ma; t amb =0to - 40 c -- 0.6 v v oh high level output voltage i o = - 0.4 ma 2.7 - v ccd v i oz output current in 3-state mode 0.4 v < v o < v ccd - 20 - +20 m a switching characteristics c lock input clk ( note 1; see f ig .15) f clk(max) maximum clock frequency tdf8704t/2 20 -- mhz tdf8704t/4 40 -- mhz tdf8704t/5 50 -- mhz t cph clock pulse width high 7 -- ns t cpl clock pulse width low 7 -- ns analog signal processing l inearity ile dc integral linearity error - 0.4 1.0 lsb dle dc differential linearity error - 0.2 0.5 lsb aile ac integral linearity error note 2 -- 2.0 lsb b andwidth (f clk =40mh z ) b - 0.5 db analog bandwidth (note 3) full-scale sine wave - 12 - mhz 75% full-scale sine wave - 16 - mhz t stlh analog input settling time low-to-high full-scale square wave; fig.8; note 4 - 2.5 3.5 ns t sthl analog input settling time high-to-low full-scale square wave; fig.8; note 4 - 3.0 4.0 ns symbol parameter conditions min. typ. max. unit
june 1994 8 philips semiconductors product speci?cation 8-bit high-speed analog-to-digital converter tdf8704 h armonics (f clk =40mh z ) h 1 fundamental harmonics (full scale) f i = 4.43 mhz -- 0db h all harmonics (full scale); all components f i = 4.43 mhz second harmonics -- 64 - 60 db third harmonics -- 58 - 55 db thd total harmonic distortion f i = 4.43 mhz -- 56 - db s ignal - to - noise ratio s/n signal-to-noise ratio without harmonics; f clk = 40 mhz; f i = 4.43 mhz 46 48 - db e ffective bits ; note 5; see figs 9, 10 and 11 eb effective bits tdf8704t/2 f clk = 20 mhz f i = 1.25 mhz - 7.8 - bits f i = 4.43 mhz - 7.6 - bits effective bits tdf8704t/4 f clk = 40 mhz f i = 4.43 mhz - 7.5 - bits f i = 7.5 mhz - 7.3 - bits f i = 10 mhz - 7.0 - bits effective bits tdf8704t/5 f clk = 50 mhz f i = 4.43 mhz - 7.4 - bits f i = 7.5 mhz - 7.2 - bits f i = 10 mhz - 6.9 - bits t wo - tone ( note 6) ttir two-tone intermodulation rejection f clk = 40 mhz -- 56 - db b it error rate ber bit error rate f clk = 40 mhz; f i = 4.43 mhz; v i = 16 lsb at code 128 - 10 - 11 - times/ samples d ifferential gain ( note 7) g diff differential gain f clk = 20 mhz; f i = 4.43 mhz - 0.6 - % d ifferential phase ( note 7) j diff differential phase f clk = 40 mhz; f i = 4.43 mhz - 0.8 - deg symbol parameter conditions min. typ. max. unit
june 1994 9 philips semiconductors product speci?cation 8-bit high-speed analog-to-digital converter tdf8704 notes 1. in addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock must be less than 1 ns. 2. full-scale sine wave (f i = 4.43 mhz; f clk = 50 mhz). 3. determined by beat frequency method on a reconstructed sine wave signal for no missing codes and no glitches. 4. the analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale input (square-wave signal) in order to sample the signal and obtain correct output data. 5. effective bits are obtained via a fast fourier transform (fft) treatment taking 4k acquisition points per period. the calculation takes into account all harmonics and noise up to half of the clock frequency (nyquist frequency). conversion to signal-to-noise ratio: s/n = eb 6.02 + 1.76 db. 6. intermodulation measured relative to either tone with analog input frequencies of 4.43 mhz and 4.53 mhz. the two input signals have the same amplitude and the total amplitude of both signals provides full scale to the converter. 7. measurement taken using video analyser vm700a. 8. output data acquisition: the output data is available after the maximum delay time of t d . timing (note 8; see figs 5 and 7; f clk = 50 mhz) t ds sampling delay time -- 2ns t h output hold time 5 -- ns t d output delay time - 12 15 ns 3-state output delay times (see figs 6 and 7) t dzh enable high - 610ns t dzl enable low - 12 16 ns t dhz disable high - 50 54 ns t dlz disable low - 10 14 ns symbol parameter conditions min. typ. max. unit fig.3 influence of t amb on v i(t) and v i(b) under 5 v supply. handbook, halfpage 60 3.49 3.43 3.45 3.47 mbd868 1.29 1.23 1.25 1.27 v i (t) (v) v i (b) (v) 20 20 60 100 t ( c) o 0.1 mv/k 0.05 mv/k v i (t) v i (b) amb fig.4 influence of supply voltage on v i(t) and v i(b) under t amb = 25 c. a ndbook, halfpage 4.25 4.75 5.75 3.44 3.38 3.40 3.42 msa689 5.25 1.28 1.22 1.24 1.26 v i (t) (v) v i (b) (v) 17 mv/v 7 mv/v v (v) cc v i (t) v i (b)
june 1994 10 philips semiconductors product speci?cation 8-bit high-speed analog-to-digital converter tdf8704 table 1 output coding and input voltage (typical values; referenced to agnd). table 2 mode selection. step v i(p-p) o/uf binary output bits d7 d6 d5 d4 d3 d2 d1 d0 under?ow < 1.48 1 1 0000000 0 1.48 0 0 0000000 1 - 0 00000001 . . . . ...... . . . ........ 254 . 0 11111110 255 3.46 0 1 1111111 over?ow > 3.46 1 1 1111111 ce d7 to d0 o/uf 1 high impedance high impedance 0 active; binary active fig.5 timing diagram for data output. handbook, full pagewidth ds t sample n 1 n sample n clk msa688 - 1 sample n 2 1.4 v v l data d0 to d7 t h cph t cpl t t d 2.4 v 0.4 v 1.4 v data n 1 data n data n 1 data n 2
june 1994 11 philips semiconductors product speci?cation 8-bit high-speed analog-to-digital converter tdf8704 handbook, full pagewidth mlb880 50 % 50 % high low dzh t dhz t 50 % high low dzl t dlz t 10 % 90 % output data ce v ccd output data 3.3 k w 15 pf s1 v ccd tdf8704 ce fig.6 timing diagram and test conditions of 3-state output delay time. test s1 t dlz v ccd t dzl v ccd t dhz gnd t dzh gnd f ce = 100 khz. fig.7 load circuit for timing measurement. handbook, halfpage mbb956 - 1 d0 to d7 15 pf
june 1994 12 philips semiconductors product speci?cation 8-bit high-speed analog-to-digital converter tdf8704 fig.8 analog input settling-time diagram. handbook, full pagewidth mbd869 50 % stlh t 2 ns code 0 code 255 i 50 % 0.5 ns 50 % 2 ns sthl t 50 % 0.5 ns clk v fig.9 fast fourier transform (f clk = 20 mhz; f i = 1.25 mhz). effective bits: 7.89; thd = - 61.05 db. harmonic levels (db): 2nd = - 84.07; 3rd = - 62.50; 4th = - 92.01; 5th = - 66.56; 6th = - 101.15. handbook, full pagewidth 3.74 0 120 0 1.25 2.49 mbd870 40 80 8.72 4.98 6.23 7.47 9.96 f (mhz) 100 20 60 amplitude (db)
june 1994 13 philips semiconductors product speci?cation 8-bit high-speed analog-to-digital converter tdf8704 fig.10 fast fourier transform (f clk = 40 mhz; f i = 4.43 mhz). effective bits: 7.61; thd = - 57.11 db. harmonic levels (db): 2nd = - 68.53; 3rd = - 58.36; 4th = - 74.89; 5th = - 65.37; 6th = - 76.08. handbook, full pagewidth 7.44 0 120 0 2.48 4.96 mbd871 40 80 17.4 9.93 12.4 14.9 19.9 f (mhz) 100 20 60 amplitude (db) fig.11 fast fourier transform (f clk = 50 mhz; f i = 10 mhz). effective bits: 6.91; thd = - 46.13 db. harmonic levels (db): 2nd = - 59.66; 3rd = - 46.67; 4th = - 70.80; 5th = - 57.96; 6th = - 72.16. handbook, full pagewidth 9.35 0 120 0 3.12 6.24 mbd872 40 80 21.8 12.5 15.6 18.7 24.9 f (mhz) 100 20 60 amplitude (db)
june 1994 14 philips semiconductors product speci?cation 8-bit high-speed analog-to-digital converter tdf8704 internal pin configurations fig.12 ttl data and overflow/underflow outputs. handbook, halfpage mlb036 dgnd d7 to d0 o/uf v cco2 v cco1 fig.13 analog inputs. handbook, halfpage mlb037 agnd v cca (x 90) v i fig.14 ce (3-state) input. b ook, halfpage mlb038 dgnd v cco1 ce
june 1994 15 philips semiconductors product speci?cation 8-bit high-speed analog-to-digital converter tdf8704 fig.15 v rb, v rt and dec. handbook, full pagewidth v rb v rt v cca dec agnd msa687 fig.16 clk input. handbook, full pagewidth 30 k w 30 k w v v ccd clk dgnd mcd189 - 1 ref
june 1994 16 philips semiconductors product speci?cation 8-bit high-speed analog-to-digital converter tdf8704 application information fig.17 application diagram. the analog and digital supplies should be separated and decoupled. (1) v rb and v rt are decoupling pins for the internal reference ladder; do not draw current from these pins in order to achieve good linearity. (2) pins 3 and 10 should be connected to dgnd in order to prevent noise influence. handbook, halfpage msa684 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 d0 d1 d2 d3 d4 d5 d6 ognd clk n.c. dec o / uf d7 n.c. dgnd ce v rb v rt v i v cca v ccd agnd v cco1 47 pf 10 nf agnd agnd 100 nf agnd v cco2 tdf8704 (1) (1) (2) (2)
june 1994 17 philips semiconductors product speci?cation 8-bit high-speed analog-to-digital converter tdf8704 package outline fig.18 plastic small outline package; 24 leads; large body; sot137-1. dimensions in mm. handbook, full pagewidth 7.6 7.4 10.65 10.00 a mbc235 - 1 0.3 0.1 2.45 2.25 1.1 0.5 0.32 0.23 1.1 1.0 0 to 8 o 2.65 2.35 detail a s 15.6 15.2 0.1 s 112 13 24 pin 1 index 0.9 0.4 (4x) 0.25 m (24x) 0.49 0.36 1.27
june 1994 18 philips semiconductors product speci?cation 8-bit high-speed analog-to-digital converter tdf8704 soldering plastic small-outline packages b ywave during placement and before soldering, the component must be fixed with a droplet of adhesive. after curing the adhesive, the component can be soldered. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. maximum permissible solder temperature is 260 c, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 c within 6 s. typical dwell time is 4 s at 250 c. a modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications. b y solder paste reflow reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement. several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow. dwell times vary between 50 and 300 s according to method. typical reflow temperatures range from 215 to 250 c. preheating is necessary to dry the paste and evaporate the binding agent. preheating duration: 45 min at 45 c. r epairing soldered joints ( by hand - held soldering iron or pulse - heated solder tool ) fix the component by first soldering two, diagonally opposite, end pins. apply the heating tool to the flat part of the pin only. contact time must be limited to 10 s at up to 300 c. when using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and 320 c. (pulse-heated soldering is not recommended for so packages.) for pulse-heated solder tool (resistance) soldering of vso packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package placement. definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation.
june 1994 19 philips semiconductors product speci?cation 8-bit high-speed analog-to-digital converter tdf8704 notes
philips semiconductors philips semiconductors C a worldwide company argentina: ierod, av. juramento 1992 - 14.b, (1428) buenos aires, tel. (541)786 7633, fax. (541)786 9367 australia: 34 waterloo road, north ryde, nsw 2113, tel. (02)805 4455, fax. (02)805 4466 austria: triester str. 64, a-1101 wien, p.o. box 213, tel. (01)60 101-1236, fax. (01)60 101-1211 belgium: postbus 90050, 5600 pb eindhoven, the netherlands, tel. (31)40 783 749, fax. (31)40 788 399 brazil: rua do rocio 220 - 5 th floor, suite 51, cep: 04552-903-s?o paulo-sp, brazil. p.o. box 7383 (01064-970). tel. (011)821-2327, fax. (011)829-1849 canada: integrated circuits: tel. (800)234-7381, fax. (708)296-8556 discrete semiconductors: 601 milner ave, scarborough, ontario, m1b 1m8, tel. (0416)292 5161 ext. 2336, fax. (0416)292 4477 chile: av. santa maria 0760, santiago, tel. (02)773 816, fax. (02)777 6730 colombia: iprelenso ltda, carrera 21 no. 56-17, 77621 bogota, tel. (571)249 7624/(571)217 4609, fax. (571)217 4549 denmark: prags boulevard 80, pb 1919, dk-2300 copenhagen s, tel. (032)88 2636, fax. (031)57 1949 finland: sinikalliontie 3, fin-02630 espoo, tel. (9)0-50261, fax. (9)0-520971 france: 4 rue du port-aux-vins, bp317, 92156 suresnes cedex, tel. (01)4099 6161, fax. (01)4099 6427 germany: philips components ub der philips g.m.b.h., p.o. box 10 63 23, 20043 hamburg, tel. (040)3296-0, fax. (040)3296 213. greece: no. 15, 25th march street, gr 17778 tavros, tel. (01)4894 339/4894 911, fax. (01)4814 240 hong kong: philips hong kong ltd., components div., 6/f philips ind. bldg., 24-28 kung yip st., kwai chung, n.t., tel. (852)424 5121, fax. (852)428 6729 india: philips india ltd, components dept, shivsagar estate, a block , dr. annie besant rd. worli, bombay 400 018 tel. (022)4938 541, fax. (022)4938 722 indonesia: philips house, jalan h.r. rasuna said kav. 3-4, p.o. box 4252, jakarta 12950, tel. (021)5201 122, fax. (021)5205 189 ireland: newstead, clonskeagh, dublin 14, tel. (01)640 000, fax. (01)640 200 italy: philips components s.r.l., viale f. testi, 327, 20162 milano, tel. (02)6752.3302, fax. (02)6752 3300. japan: philips bldg 13-37, kohnan 2 -chome, minato-ku, tokyo 108, tel. (03)3740 5028, fax. (03)3740 0580 korea: (republic of) philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. (02)794-5011, fax. (02)798-8022 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. (03)750 5214, fax. (03)757 4880 mexico: philips components, 5900 gateway east, suite 200, el paso, tx 79905, tel. 9-5(800)234-7381, fax. (708)296-8556 netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb tel. (040)783749, fax. (040)788399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. (09)849-4160, fax. (09)849-7811 norway: box 1, manglerud 0612, oslo, tel. (022)74 8000, fax. (022)74 8341 pakistan: philips electrical industries of pakistan ltd., exchange bldg. st-2/a, block 9, kda scheme 5, clifton, karachi 75600, tel. (021)587 4641-49, fax. (021)577035/5874546. philippines: philips semiconductors philippines inc, 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. (02)810 0161, fax. (02)817 3474 portugal: philips portuguesa, s.a., rua dr. antnio loureiro borges 5, arquiparque - miraflores, apartado 300, 2795 linda-a-velha, tel. (01)14163160/4163333, fax. (01)14163174/4163366. singapore: lorong 1, toa payoh, singapore 1231, tel. (65)350 2000, fax. (65)251 6500 south africa: s.a. philips pty ltd., components division, 195-215 main road martindale, 2092 johannesburg, p.o. box 7430 johannesburg 2000, tel. (011)470-5911, fax. (011)470-5494. spain: balmes 22, 08007 barcelona, tel. (03)301 6312, fax. (03)301 42 43 sweden: kottbygatan 7, akalla. s-164 85 stockholm, tel. (0)8-632 2000, fax. (0)8-632 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. (01)488 2211, fax. (01)481 77 30 taiwan: philips taiwan ltd., 23-30f, 66, chung hsiao west road, sec. 1. taipeh, taiwan roc, p.o. box 22978, taipei 100, tel. (02)388 7666, fax. (02)382 4382. thailand: philips electronics (thailand) ltd., 209/2 sanpavuth-bangna road prakanong, bangkok 10260, thailand, tel. (662)398-0141, fax. (662)398-3319. turkey: talatpasa cad. no. 5, 80640 gltepe/istanbul, tel. (0 212)279 2770, fax. (0212)269 3094 united kingdom: philips semiconductors limited, p.o. box 65, philips house, torrington place, london, wc1e 7hd, tel. (071)436 41 44, fax. (071)323 03 42 united states: integrated circuits: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. (800)234-7381, fax. (708)296-8556 discrete semiconductors: 2001 west blue heron blvd., p.o. box 10330, riviera beach, florida 33404, tel. (800)447-3762 and (407)881-3200, fax. (407)881-3300 uruguay: coronel mora 433, montevideo, tel. (02)70-4044, fax. (02)92 0601 for all other countries apply to: philips semiconductors, international marketing and sales, building baf-1, p.o. box 218, 5600 md, eindhoven, the netherlands, telex 35000 phtcnl, fax. +31-40-724825 scd31 ? philips electronics n.v. 1994 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. printed in the netherlands 533061/1500/03/pp20 date of release: june 1994 document order number: 9397 734 10011

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